منابع مشابه
Advanced Interconnect Technologies for Future ULSI Applications
Scaling trends and limitations of existing interconnect technologies are discussed and two prospective future solutions carbon nanotube (CNT) and optical interconnects are examined in detail. The inherent unscalability of metal interconnects and degradation of their performance in the light of ever-increasing transistor density and performance is emphasized. Problems with multi-layer low-k/copp...
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A new analytical model is presented to accurately determine crosstalk noise due to on-chip interconnections. This model takes into account interconnect line resistance and driver strength, which have not been adequately considered in previous crosstalk models. Our model can be used in conjunction with simple analytical device timing expressions to provide close agreement with SPICE simulations ...
متن کاملAnalog Design in ULSI CMOS Processes
This paper discusses some of the advantages and of the disadvantages of using a CMOS process in the 180 – 100 nm range for the design of analog blocks in mixed-mode integrated circuits.
متن کاملImpulse based UWB Transmitter in 0.18 μm CMOS for Wireless Interconnect in Future ULSI
1. Introduction To meet the challenge of 3D-intergration in future ULSI, global wireless interconnection (interconnect distance above 300 µm) which utilizes electromagnetic wave transmission by using integrated antenna and ultra wideband (UWB) transceiver system has been proposed [1, 2] as shown in Fig. 1. Among the different techniques for UWB system, impulse radio based UWB uses very short Ga...
متن کاملInterconnect design with VLSI CMOS
Historically, high-performance logic circuit interchip design has focused on bipolar emitter-coupled logic (ECL) circuits and signals, but VLSl CMOS has attained performance levels at which problems unique to its characteristics must be addressed for design optimization. In this paper, CMOS interchip circuit models are applied to develop packaging and wiring constraints for synchronous communic...
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ژورنال
عنوان ژورنال: Materia Japan
سال: 1997
ISSN: 1340-2625,1884-5843
DOI: 10.2320/materia.36.555